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SS26 Surface Mount Schottky Power Rectifier
SMB Power Surface Mount Package
. . . employing the Schottky Barrier principle in a metal-to-silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes.
Features http://onsemi.com
* * * * * * * * * * * * * *
Compact Package with J-Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Overvoltage Protection Low Forward Voltage Drop Pb-Free Package is Available Case: Molded Epoxy Epoxy Meets UL 94, V-O at 0.125 in Weight: 95 mg (approximately) Cathode Polarity Band Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Available in 12 mm Tape, 2500 Units per 13 Reel, Add "T3" Suffix to Part Number Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable ESD Ratings: Human Body Model = 3B Machine Model = C Marking: SS26
Rating Symbol VRRM VRWM VR IO IFSM Value 60 Unit V
SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES 60 VOLTS
Mechanical Characteristics:
SMB CASE 403A PLASTIC
MARKING DIAGRAM
SS26
SS26 = Device Code
MAXIMUM RATINGS ORDERING INFORMATION
Device SS26T3 2.0 40 A A SS26T3G Package SMB SMB (Pb-Free) Shipping 2500 / Tape & Reel 2500 / Tape & Reel Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TL = 95C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage/Operating Case Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25C)
Tstg, TC TJ dv/dt
-55 to +150 -55 to +150 10,000
C C V/ms
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
Semiconductor Components Industries, LLC, 2005
February, 2005 - Rev. 2
1
Publication Order Number: SS26/D
SS26
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance - Junction-to-Lead (Note 1) Thermal Resistance - Junction-to-Ambient (Note 2) 1. Mounted with minimum recommended pad size, PC Board FR4. 2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. Symbol RqJL RqJA Value 24 80 Unit C/W
ELECTRICAL CHARACTERISTICS
Value Characteristic Maximum Instantaneous Forward Voltage (Note 3) (iF = 1.0 A) (iF = 2.0 A) (VR = 60 V) Symbol vF TJ = 25C 0.51 0.63 0.2 TJ = 125C 0.475 0.55 10 Unit V
Maximum Instantaneous Reverse Current (Note 3) 3. Pulse Test: Pulse Width 250 ms, Duty Cycle 2.0%.
IR
mA
10 IF, INSTANTANEOUS FORWARD CURRENT (A) 75C 125C 25C
10 IF, INSTANTANEOUS FORWARD CURRENT (A)
125C
75C 25C
1
1
0.1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.0E-02 125C IR, REVERSE CURRENT (A)
100 25C f = 1 MHz C, CAPACITANCE (pF) 20 30 40 10 0
1.0E-03 1.0E-04 1.0E-05 25C 1.0E-06 1.0E-07 75C
0
10
50
60
10
20
30
40
50
60
VR, REVERSE VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
Figure 4. Typical Capacitance
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SS26
PFO, AVERAGE POWER DISSIPATION (W) IF, AVERAGE FORWARD CURRENT (A) 3.5 3 2.5 2 1.5 1 0.5 0 60 70 80 90 100 110 120 130 SQUARE WAVE dc 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 SQUARE WAVE dc
0
0.5
1
1.5
2
2.5
3
TL, LEAD TEMPERATURE (C)
IO, AVERAGE FORWARD CURRENT (A)
Figure 5. Current Derating - Junction to Lead
RT, TRANSIENT THERMAL RESISTANCE (NORMALIZED) RT, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
Figure 6. Forward Power Dissipation
1.0E+00 50% 20% 1.0E-01 10% 5.0%
1.0E-02 2.0% 1.0% Rtjl(t) = Rtjl*r(t)
1.0E-03
1.0E-04 0.00001 0.0001 0.001 0.01 0.1 t, TIME (s) 1.0
10
100
1000
Figure 7. Thermal Response - Junction to Case
1.0E+00
50% 20% 10% 5.0%
1.0E-01
1.0E-02 2.0%
1.0E-03 1.0%
Rtjl(t) = Rtjl*r(t)
1.0E-04
0.00001
0.0001
0.001
0.01
0.1 t, TIME (s)
1.0
10
100
1000
Figure 8. Thermal Response - Junction to Ambient
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3
SS26
PACKAGE DIMENSIONS
SMB PLASTIC PACKAGE CASE 403A-03 ISSUE D
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. INCHES DIM MIN MAX A 0.160 0.180 B 0.130 0.150 C 0.075 0.095 D 0.077 0.083 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.205 0.220 MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59
S A
D
B
C
K
P
J
H
SOLDERING FOOTPRINT*
2.261 0.089
2.743 0.108
2.159 0.085
SCALE 8:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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4
SS26/D

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